RRP Electronics has forged a strategic alliance with US-based Deca Technologies, Inc. to supercharge its wafer-level packaging capabilities.will integrate Deca’s cutting-edge Wafer-Level Chip Scale Packaging (WLCSP) and M-Series™️ Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes. This will elevate the company’s ability to deliver high-performance semiconductor solutions to customers worldwide.
Deca Technologies, a leader in advanced semiconductor packaging with backing from industry giants like Qualcomm, Infineon, and ASE Group, sees this alliance as a gateway to India’s booming electronics and semiconductor ecosystem.
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